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MediaTek Announces its Latest MediaTek Dimensity 7200 Chipset: Here’s More About it

MediaTek has just announced its latest MediaTek Dimensity 7200 chipset which will focus both on better gaming experience and better camera features on mid-range smartphones.

The upcoming Vivo V27 smartphone is also expected to come equipped with the latest MediaTek Dimensity 7200 chipset.

Read more about it below.

MediaTek Dimensity 7200 Chipset

The latest chipset from MediaTek, the MediaTek Dimensity 7200 chipset is made using the N4P process which is also used in the MediaTek Dimensity 9200 chipsets and is made by TSMC(Taiwan Semiconductor Manufacturing Company).

The MediaTek Dimensity 7200 chipset has a core configuration of 2 + 6 cores and its architecture includes two Cortex-A715 cores and six Cortex-A510 cores. The chipset will also be having a primary clock speed of 2.8 GHz.

The latest MediaTek chipset also has the Mali G610 MC4 GPU which will support HDR10+, Dolby HDR, CUVA HDR and will also support a FHD display with a refresh rate of upto 144Hz.

As mentioned, the latest MediaTek Dimensity 7200 chipset is going to focus on mainly two things, better gaming experience and better camera features. For this the chipset uses the MediaTek HyperEngine 5.0 and the 14-bit HDR ISP.

The MediaTek HyperEngine 5.0 has the UFS 3.1 storage along with the LPDDR5 RAM which runs at a speed of upto 6,400 Mbps. The 14-bit HDR ISP equipped in the chipset will be able to support a main camera of upto 200MP and will support 4K HDR video capturing. The APU(accelerated processing unit) in the chipset also provides a number of AI powered camera improvements and features including a real-time portrait beautification.

The latest chipset will also support WiFi 6E with triple band support, Bluetooth of version 5.3 and NFC. It will also support 5G network connectivity in both the SIMs as well.

The upcoming Vivo V27 5G smartphone, as of now, is the only smartphone that is expected to come equipped with the latest MediaTek Dimensity 7200 chipset.

 



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