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Infinera Signs Non-Binding Preliminary Memorandum of Terms to Receive Up to $93 Million in CHIPS Act Funding

Proposed funding, combined with investment tax credits, could result in more than $200 million in total federal incentives to expand production and packaging of semiconductors to support critical U.S. infrastructure and AI

Proposed funding, combined with investment tax credits, could result in more than $200 million in total federal incentives to expand production and packaging of semiconductors to support critical U.S. infrastructure and AI

Disclaimer: The above press release comes to you under an arrangement with GlobeNewswire. TheTechOutlook.com takes no editorial responsibility for the same.

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