MediaTek has announced the Dimensity 8400, introducing the first All Big Core chip design to the premium smartphone segment. The new chipset features eight Arm Cortex-A725 cores running at up to 3.25GHz, an Arm Mali-G720 GPU.
The Dimensity 8400 delivers 41% higher multi-core performance compared to the previous Dimensity 8300, while reducing peak power consumption by 44%. The Mali-G720 GPU provides 24% higher peak performance, 42% greater power efficiency than its predecessor.
For AI capabilities, the chip integrates the NPU 880 to support mainstream language models, generative AI applications. It also includes the Dimensity Agentic AI Engine (DAE), previously launched with the Dimensity 9400 flagship chip.
“MediaTek is redefining premium smartphone experiences with the Dimensity 8400, unleashing creativity with generative and agentic AI applications and taking mobile gaming even further,” said Dr. Yenchi Lee, General Manager of MediaTek’s Wireless Communications Business Unit. “Our All Big Core design, which we’ve also integrated into our flagship chips, highlights the impressive performance and efficiency that can go hand-in-hand so consumers don’t have to compromise.”
The chipset features the MediaTek Imagiq 1080 ISP with QPD remosaic technology, supports HDR recording across the entire zoom range. Its connectivity features include a 5G-A modem supporting up to 3CC-CA with speeds up to 5.17Gbps, Network Observation System (NOS) technology for network switching optimization.
Display capabilities include support for WQHD+ resolution at up to 144Hz refresh rate, dual screen functionality.
MediaTek has confirmed that smartphones powered by the Dimensity 8400 will be available in the market by the end of 2024.
