Taiwanese chipmaker company MediaTek officially launched its new Dimensity 6000 series. This new series has been launched with a chipset named DImensity 6100+ SoC that promises to deliver exceptional power efficiency, vivid displays, high frame rates, AI-powered camera technologies, leading low power consumption, and Sub 6 5G connectivity. Let’s get to know about its key features
Features
The Dimensity 6100+ has a 5G modem supporting 3GPP Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation. This chip features two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores that deliver significant enhancement, including support for AI-powered cameras, 10-bit displays, outstanding UX and GPU performance, and rich peripheral features.
Other key features include support for up to 108MP Non-ZSL camera, 2K 30fps video capture, UltraSave 3.0+ technology that offers 20% reduced 5G power consumption, Powerful camera features including AI-bokeh for stunning portraits and selfies; working with Arcsoft, MediaTek is also bringing AI-color technology.
“As developing markets continue rolling out 5G networks at a rapid pace and operators in developed markets work to finish transitioning consumers from 4G LTE to 5G, there has never been a more vital need for chipsets that cater to the growing number of mainstream mobile devices that feature next-generation connectivity,” said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit. “The MediaTek Dimensity 6000 series makes it possible for device makers to stay ahead of the curve with impressive upgrades that boost performance, increase power efficiency and reduce material costs.”
