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OPPO Find X6 Pro has Appeared on GeekBench Revealing More About its Processor

The GeekBench listing of the OPPO Find X6 Pro smartphone reveals the details regarding the chipset used in the device, its performance and also about the operating system in which the phone runs.

Read more about it below.

OPPO Find X6 Pro Shows Up on GeekBench

The Chinese smartphone brand, OPPO is under the plans of releasing the OPPO Find X6 series devices in China later this month and ahead of the launch one of the devices in the series have appeared on the GeekBench listing.

The series will comprise of the OPPO Find X6 and the OPPO Find X6 Pro smartphones and the device which appeared on the GeekBench listing is the OPPO Find X6 Pro smartphone. It has also appeared with a model number of PGEM10.

OPPO Find X6 Pro

From the listing, the OPPO Find X6 Pro has a single-core score of 2000 points and a multi-core score of 5635 points.

The upcoming smartphone is also now confirmed to come equipped with the top tier Snapdragon 8 Gen 2 chipset from Qualcomm as the listing reveals the smartphone’s motherboard codename to be “kalama”, which points to this chipset.

The device will also be having a processor with 8 cores of which the primary core will have a clock speed of 3.19GHz. Four of the cores will have a clock speed of 2.80 GHz and the other three cores will have a clock speed of 2.02 GHz.

The smartphone is also going to run on the Android 13 based Color OS 13.1 custom user interface and will have a LPDDR5X RAM of 16GB.

From what is now known, the upcoming smartphone is also expected to feature a 6.8″ Samsung E6 AMOLED display which will have a 2K screen resolution and a refresh rate of 120Hz. The display might also have a peak brightness rate of 2,500 nits as well.

A leaked alleged live image of the smartphone which came out earlier this week also reveals the rear camera setup of the upcoming OPPO Find X6 Pro smartphone.

From the leaked live image of the smartphone, the OPPO Find X6 Pro has a circular camera module on its rear with a triple rear cameras and an LED flash on the top of the camera module. The camera module can be divided into an upper and lower region with the upper region housing two of the cameras and the LED flash. On the bottom of the upper part we can also find the HASSELBLAD branding as well.

Now regarding the lower part, the smartphone has one of its cameras placed here along with the MariSilicon branding. The camera on the lower part will also likely be the 1 inch camera sensor.

More details about the smartphone is still yet to come and will be made available after the launch of the smartphone.

 



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