MediaTek Announces New Dimensity Chip Product Launch Conference for This Month: Dimensity 8400 Unveiling Soon

The Taiwanese semi-conductor company, MediaTek, has now announced that it will be conducting a product launch conference this month to unveil a new Dimensity chip. As per expected, the Dimensity 8400 sub-flagship chip is soon going to break its cover.

Here’s more about it.

MediaTek to Launch Dimensity 8400 on 23rd December?

Following the Dimensity 9400 flagship chip launch in October 2024, MediaTek was reportedly said to conduct its next Dimensity 8400 sub-flagship chip launch event on the 23rd of December 2024, and now it is official. Via the poster image shared, it is understood that a new Dimensity chip will be unveiled by the brand on the 23rd of December 2024 at 3:00 PM local time in China, and this is obviously the Dimensity 8400 chip itself according to recent reports.

Speaking of the expected core specs and details of the upcoming Dimensity chip, it has been pointed out to feature an octa-core architecture with all big cores and made using TSMC’s 4nm process technology. The core configuration consists of a Cortex A725 primary core with 3.25 GHz clock speed, three Cortex A725 performance cores with 3.0 GHz clock speed, and four Cortex A725 efficiency cores with 2.1 GHz clock speed.

It is also revealed to be integrated with an ARM Immortalis G720 MC7 GPU as well, clocked at 1.3 GHz. Performance wise, it is reported to sit in between Qualcomm’s Snapdragon 8 Gen 2 and Snapdragon 8 Gen 3 processors. The AnTuTu running score is also said to have reached up to 180W+ (1.8 million+) too.

After the official launch of the Dimensity 8400 chip taking place next week, we may soon hear smartphone brands starting to announce their upcoming devices that are going to be powered by this latest Dimensity chip. So far, Xiaomi is the only brand that is expected to debut a smartphone model with this chip (as per HyperOS codebase).

Stay tuned for more updates.