South Korea-based tech giant Samsung announced that it has begun mass production for the industry’s thinnest 12 nanometer 12GB and 16GB LPDDR5X DRAM packages. The company says that with its expertise in chip packaging, it can develop ultra-slim LPDDR5X DRAM packages that will eventually help create additional space within mobile devices to facilitate better airflow. With increasing demand for on-device AI functions it’s important that mobile manufacturers also ensure better thermal control.
The company claims that the new LPDDR5X DRAM packages have reduced the thickness by 9% and improved the heat resistance by about 12.2% in comparison to the previous generation. Several things have been used or considered to make the new LPDDR DRAM packages as thin as a fingernail and that is optimizing printed circuit board, epoxy molding compound techniques, and back lapping process. Samsung has plans to develop the 6-layer 24GB and 8-layer 32GB modules as the demand for high-density mobile memory solutions in smaller package sizes grows in the coming days.
“Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package,” said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. “We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market.”
