MediaTek has recently launched the Dimensity 9200 Plus chipset, which powers the iQOO Neo 8 Pro in the Chinese market. The Taiwanese chip maker is now said to be working on a couple of more high-end chips. Recent reports have claimed that it may announce the Dimensity 9300 SoC in November this year. A new leak suggests that it could be working on another chip called the Dimensity 8300.
The Dimensity 8300 is expected to succeed the Dimensity 8200 chip, which went official in December 2022. Hence, it is likely that the D8300 may debut around the same time this year.
According to tipster Revengus, the Dimensity 8300 chip will adopt the 1 + 3 + 4 architecture. It will arrive with 1 x Cortex-X3 CPU core working at 2.8GHz, 3 x Cortex-A714 CPU cores operating at 2.4GHz, and 4 x Cortex-A510 CPU cores clocked at 1.6GHz. For graphics, the chip will be equipped with an ARM Mali G52-MC6 GPU that works at 850MHz.
In comparison, the Dimensity 8200 chip has 1 x 3.1GHz Cortex-A78, 3 x 3.0GHz Cortex-A78, 4 x 2.0GHz Cortex-A55, and a Malic-G610 MC6 GPU. The D8200 was positioned lower than the D9200. Hence, it is likely that the upcoming D8300 will be positioned lower than the Dimensity 9300 flagship chip, which may debut in November this year.
To recall, iQOO announced the iQOO Neo 7 SE in December last year as the first-ever Dimensity 8200 chipset phone. Later in the same month, Redmi unveiled the Redmi K60E with the D8200 SoC onboard. The iQOO Neo 7 SE was rebranded as the iQOO Neo 7 in the Indian market in February this year. It is likely that the successors of these devices will feature the Dimensity 8300 chip.
