Predictions made about iPhone 15 Pro & 15 Pro Max supporting USB 3.2 or Thunderbolt 3 by analyst Ming-Chi Kuo
Ming-Chi Kuo, an analyst at TF International Securities, made predictions about a spec upgrade in the high-end iPhone 15 series. According to the senior analyst, iPhone 15 Pro & 15 Pro Max will support at least USB 3.2 or Thunderbolt 3. The spec upgrade will significantly improve the wired transfer and video output user experience.
Here’s his tweet about admitting predictions:-
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I predict that 15 Pro & 15 Pro Max will support at least USB 3.2 or Thunderbolt 3. This spec upgrade means the wired transfer and video output user experience will significantly improve.— 郭明錤 (Ming-Chi Kuo) (@mingchikuo) November 17, 2022
The analyst tweeted to inform about his predictions mentioning how the “2H23 new high-end iPhones’ wired transfer speed will likely improve markedly”. He also mentioned how this will benefit the growth of the high-speed transfer IC design industry.
Since there will be an upgrade in the iPhone it’ll lead to the most benefits of Apple’s existing suppliers (e.g., Parade, Asmedia, Genesys Logic, Renesas, etc.).
In the latest survey done by the analyst, Ming-Chi Kuo, it has been indicated that all 2H23 new iPhones will abandon Lightning and change to USB-C. The main predictions however remained that only two high-end models of the Apple iPhone – iPhone 15 Pro & 15 Pro Max- will support the wired high-speed transfer.
Check out the statement in his tweet here:-
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My latest survey indicates all 2H23 new iPhones will abandon Lightning and change to USB-C, but only two high-end models (15 Pro & 15 Pro Max) will support the wired high-speed transfer, and the two standard ones (15 & 15 15 Plus) still support USB 2.0 same as Lightning.— 郭明錤 (Ming-Chi Kuo) (@mingchikuo) November 17, 2022
“This spec upgrade and the new trend will drive Apple ecosystem’s demand for high-speed transfer chips and competitors’ imitation (almost all Android phones currently only support USB 2.0), and it’s also conducive to the growth of the high-speed transfer IC design industry” stated the analyst in his tweet.
