Daily Tech News, Interviews, Reviews and Updates

Qualcomm officially unveiled S5 Gen 3 and S3 Gen 3 sound platforms for wireless audio devices

Qualcomm has today officially unveiled two new sound platforms- S5 Gen 3 and S3 Gen 3 that are said to enhance the listening experience of users for both premium and mid-tier earbuds, headphones, and speakers.

Qualcomm S5 Gen 3 and S3 Gen 3: Features

Both sound platforms enable rich and responsive AI-driven sound experiences. They offer powerful adaptive ANC, improved DAC for pristine sound, new audio-sharing experiences with LE audio, and extensive and innovative solutions available via the Qualcomm Voice and music extension program.

These new platforms will likely be improving the sound quality and connectivity in gadgets like earbuds, headphones, and speakers. They support Snapdragon sound and 24-bit 48kHz lossless music streaming. Both these chipsets support Bluetooth 5.4 connectivity.

Qualcomm S3 Gen 3 supports Alexa and Google Assistant and also supports Google Fast Pair for faster pairing. It supports up to three microphones on each earbud. It offers extremely low power performance. It is equipped with a powerful quad-core processor architecture supporting complex use cases, Qualcomm TrueWireless mirroring technology, embedded ROM+RAM and external Q-SPI flash, 3 microphone Qualcomm cVc, high-performance audio combined with low power consumption, and is designed for Snapdragon sound. It supports Qualcomm Adaptive ANC- feedforward, feedback, hybrid and adaptive.

Qualcomm S5 Gen 3 supports features like Adaptive ANC and Adaptive Transparency. It is approximately 50 times more on-device AI computing than the Qualcomm S5 Gen 2 platform, It has 1.5 times more memory than the S5 Gen 2 platform. It comes with a dedicated AI core to provide higher performance and lower power for ML applications compared to using the DSP while it has dedicated cores for audio curation including hearing loss compensation, ANC, transparency, and noise management. It offers USB High-Speed PHY at 480 Mbps.

It is said that these newly unveiled audio chips will be available soon to earphone makers and the chips are expected to hit the market later this year or early next year.



Readers like you help support The Tech Outlook. When you make a purchase using links on our site, we may earn an affiliate commission. We cannot guarantee the Product information shown is 100% accurate and we advise you to check the product listing on the original manufacturer website. Thetechoutlook is not responsible for price changes carried out by retailers. The discounted price or deal mentioned in this item was available at the time of writing and may be subject to time restrictions and/or limited unit availability. Amazon and the Amazon logo are trademarks of Amazon.com, Inc. or its affiliates Read More
You might also like

This website uses cookies to improve your experience. We'll assume you're ok with this, but you can opt-out if you wish. Accept Read More