MediaTek, the Taiwanese semiconductor company, announced its Dimensity 9300 chipset last year in the month of November 2023, and many flagship devices such as the OPPO Find X7, iQOO Neo 9 Pro, and Vivo X100 series smartphones were unveiled with the latest MediaTek flagship processor onboard.
The next Dimensity 9400 chipset has already been reported to be in the works and a Chinese tipster has now shared a few of the performance specs of this processor via a Weibo post online.
Here’s more about it.
MediaTek Dimensity 9400 Chipset – Tipped Performance Specs
This update is from the reliable tipster Digital Chat Station which has noted that the Dimensity 9400 chipset of MediaTek will be based on TSMC’s second-generation 3nm process technology, and will comprise of ARM’s latest CPU and GPU units (public version). The tipster also points out that its design performance is very strong, and suggests that with the excellent performance that the Dimensity 9300 processor offers, more smartphone manufacturers may tend to use the Dimensity 9400 chipset for their future flagships after the processor launch.
In related news, Qualcomm, another semiconductor company based in America and a rival to MediaTek, is also in the works with its next Snapdragon 8 Gen 4 processor. This chipset was previously revealed to use the 3nm process technology itself, just like MediaTek’s upcoming Dimensity 9400 chipset.
Also to add, the Snapdragon 8 Gen 4 chipset is said to use a self-developed architecture, likely comprising of the brand’s ambitious Oryon cores. As per what other recent updates revealed, the processor will possibly only be using the Oryon cores without any ARM reference cores, and the next Xiaomi 15 and Samsung Galaxy S25 Ultra may probably arrive equipped with this Snapdragon chipset.
