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Galaxy S25 FE Tipped To Arrive With MediaTek Dimensity SoC

We have been sharing  with you all the latest updates regarding Samsung’s next flagship smartphone series- Galaxy S25 series lately whether it’s the leaked images, expected specs or certification listings, we have it all covered for our readers. Well now Galaxy S25 FE has also become a part of rumor mill.

Every year Samsung unveils its flagship series and then after few months the FE model of the series is unveiled. This year also Samsung unveiled Galaxy S24 FE last month while Galaxy S24 series arrived in January. Ahead of the rumored launch of Galaxy S25 series, a major update regarding Galaxy S25 FE model has been revealed online.

As per a user named @Jukanlosreve on X platform, there were negotiations going on between Samsung and MediaTek to include Dimensity chip in Galaxy S25, it is now said that Dimensity Chipset will now be included in S25 FE while S25 series will use Snapdragon chips only. It is assumed that this Galaxy S25 FE Dimensity chip could possibly be the newly launched Dimensity 9400 SoC.

When a user asked about Exynos chipset being excluded this year, the tipster mentioned that if the yield rate of Exynos improves, it could be used in the next Galaxy foldable devices- Z Fold 7 and Z Flip 7. Well it’s still too early to get any details about Galaxy S25 FE model but lets see what Samsung as in its store for the Galaxy fans.



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