MediaTek Dimensity 8400 Chip Tentative Launch Date and Detailed Parameters Revealed by Chinese Tipster
We have already come across reports pointing out that MediaTek is in the works with its next Dimensity 8400 sub-flagship chip following the Dimensity 9400 flagship chip debut two months back, and a few core details regarding it were shared online as well. Now, the same tipster who revealed the previous update has revealed via a new Weibo post the tentative launch date and the detailed parameters of MediaTek’s upcoming Dimensity 8400 chip.
Read more about it below.
MediaTek Dimensity 8400 Chip – Tentatively Scheduled to Launch on 23rd December
As per this new Weibo update from tipster Digital Chat Station, he notes that the Dimensity 8400 chip from MediaTek is tentatively scheduled to have its launch on the 23rd of December 2024, this month. Just like what was expected, the Dimensity 8400 chip is again suggested to be made using TSMC’s 4nm process technology.
Coming to the detailed parameters, the Dimensity 8400 chip will be having an octa-core architecture with a Cortex A725 primary core clocked at 3.25GHz, three Cortex A725 performance cores clocked at 3.0GHz, and four Cortex A725 efficiency cores clocked at 2.1GHz. Thus, the chip has an all-big-core CPU architecture. The chip is also said to be integrated with the ARM Immortalis G720 MC7 GPU clocked at 1.3GHz, and the AnTuTu running score has reportedly reached up t0 180W+ (1.8 million+).
Speaking more, the performance of the new MediaTek Dimensity 8400 chip is revealed to sit in between Qualcomm’s Snapdragon 8 Gen 2 and Snapdragon 8 Gen 3 chips. Moreover, Xiaomi’s HyperOS codebase suggests that this latest chip could be soon arriving on a Xiaomi/Redmi/POCO branded device.
Stay tuned for more updates.
