The Taiwanese semi-conductor company, MediaTek, unveiled its flagship Dimensity 9400 chip back in October 2024 and the same month also witnessed the launch of a few smartphone models powered by this processor. Now, a Chinese tipster on the Weibo platform has revealed a new update concerning the early specifications of the next Dimensity 9500 flagship chip.
Read more about the update below.
MediaTek Dimensity 9500 – Tipped Early Specifications
This update comes from the reliable tipster – Digital Chat Station and as per his latest Weibo update, the next Dimensity 9500 chip from MediaTek is revealed to feature a 2 ‘Travis’ + 6 ‘Gelas’ core configuration with two Cortex X930 cores and six Cortex A730 cores. The frequency is suggested to be possibly up to 4 GHz, and the chip is said to be made using TSMC’s N3P process technology with SME instruction set support. Moreover, the tipster adds that the performance of the new iterative chip is also likely to receive a big upgrade over the predecessor.
Also to add, it has been further added that the first wave of smartphones that are expected to use the mentioned chip, is likely going to come in two sizes – large and small, along with full periscope telephoto specifications.
Speaking of few other related updates, the brand released its Dimensity 8400 sub-flagship chip recently and the Redmi Turbo 4 smartphone from Xiaomi is believed to be the first to use this newly-released chip (Dimensity 8400 ‘Ultra’). Xiaomi’s Redmi Turbo 4 smartphone is also now confirmed to debut next month, on the 2nd of January 2025, in the Chinese market.
Stay tuned for more updates.
